Semiconductor Carrier and Substrate Glass

Semiconductor Carrier and Substrate Glass

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TE series glass exhibits specific expansion coefficient, excellent thermal, mechanical, chemical properties, along with superior optical transmittance across the entire wavelength range. It is used in wafer manufacturing, packaging and testing of semiconductor glass carrier and substrate. Professional customized services can be provided according to customer requirements.

Semiconductor Carrier and Substrate Glass

Semiconductor Carrier and Substrate Glass

Glass strips thickness≤ 30mm, width ≤ 320mm, and length could be customized.Finished wafers and wafers in various sizes (4-12 inches) after polishing are available. Under normal circumstances, TTV<1μm, Ra<0.5nm, Wrap/Bow<30μm. Please consult the sales for specific dimensions and accuracy.

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