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Various specifications of glass rod blanks could be molded and supplied.Rod blanks diameter 3.5mm～30mm，Length≤300mm.
Low Softening Point Glass Ball
Low softening point glass ball for molding available. Please consult the sales for specific dimensions and tolerances.
Glass-ceramic is produced through a crystallization heat treatment process at a specific temperature, resulting in the uniform precipitation of numerous tiny crystals within the glass. This forms a dense multiphase composite consisting of microcrystalline and glass phases. Not only does it retain the fundamental advantages of glass, such as high softening temperature, excellent electrical insulation, and good chemical stability, but it also embodies the superior properties of ceramics, including high wear resistance, hardness, mechanical strength, and thermal stability. Through ion exchange, the glass becomes more resistant to impact, drops, and scratches. It is widely used in the fields of mobile phone cover glass and smart wearable devices.
With years of experience in the research and development of special functional glass, Gabrielle Optech has innovatively launched GPL series of glass fibers with low dielectric (DK), low loss (DF) and llow expansion. These glass fibers are primarily used in 5G/6G communications, AI servers, AI glasses, AIPC and other fields. By significantly reducing the dielectric loss of communication components, they can effectively enhance the efficiency of high-frequency signal transmission. Additionally, they possess core advantages such as low heat generation, low latency, low power consumption, high reliability, and miniaturization. Gabrielle Optech can provide low dielectric and low expansion yarn as well as electronic glass fiber cloth.
Semiconductor Carrier and Substrate Glass
TE series glass exhibits specific expansion coefficient, excellent thermal, mechanical, chemical properties, along with superior optical transmittance across the entire wavelength range. It is used in wafer manufacturing, packaging and testing of semiconductor glass carrier and substrate. Professional customized services can be provided according to customer requirements.
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